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Job Requirements of Opto-Mechanical Packaging Engineer - Lasers - Nashua, NH:
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Employment Type:
Full-Time
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Education:
4 Year Degree
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Location:
Nashua, NH (Onsite)
Do you meet the requirements for this job?
Opto-Mechanical Packaging Engineer - Lasers - Nashua, NH
The Opto-Mechanical Packaging Engineer will collaborate with other engineers to develop advanced Lasers and production laser systems. They will be responsible for creating and maintaining 3D Models and drawings of Laser Diode components, coordinating with third-party manufacturing vendors, and engineering drawings, and more.
Client Details
My client is a technology company known for its expertise in developing next-generation semiconductor based lasers and devices, particularly in the field of laser diodes. They are recognized for their innovative work in advancing semiconductor technology for various applications.
Description
In this role you will report directly into the Director of Opto-Mechanical Packaging Engineering and be responsible for:
- Utilize SolidWorks to design mechanical components and hardware, converting them into production-focused layout, fabrication, and assembly drawings.
- Generate comprehensive assembly and fabrication specifications and documentation for product designs.
- Apply 3-D CAD tools to conceptualize layouts and detailed designs of mechanical components and assemblies, supporting Product Design Engineering.
- Create detailed Visual Aids to aid in product assembly.
- Work independently on small projects and collaboratively within teams on larger initiatives.
- Maintain the primary CAD model at the system level to ensure design accuracy and integrity.
- Prepare drawings and specifications according to ANSI Y14.5 standards, manage Bills-of-Material, attend internal team meetings to review designs, and assist in test data provision for Government/R&D solicitations and drafting technical materials for sales and marketing support.
Profile
A successful candidate will have the following:
- Bachelor's Degree and 8+ years of industry experience, or a Master's Degree with 3+ years of experience
- Experience with lasers, epitaxy, fabrication, testing, and design / modeling
- Ability to develop and execute packaging design and implementation strategy
- Hands on bonding and package assembly processes and testing of reliability stress
- Knowledge of semiconductor devices and/or reliability engineering
- Strong written and Verbal communication skills
Job Offer
The candidate will receive:
- Competitive salary and potential for salary growth
- Comprehensive benefits package, including health insurance, retirement plans, and vacation/sick leave
- Opportunities for professional development and career advancement
- A positive work environment that values collaboration and innovation
- Work-life balance and flexible scheduling options
- Access to cutting-edge technologies and resources
- Engaging and challenging projects that foster skill development
- Supportive and inclusive company culture
- Networking opportunities within the industry
- Potential for performance-based bonuses or incentives.
MPI does not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity or expression, national origin, age, disability, veteran status, marital status, or based on an individual's status in any group or class protected by applicable federal, state or local law. MPI encourages applications from minorities, women, the disabled, protected veterans and all other qualified applicants.