Electronics - Manager Packaging Engineering - Newbury, MA

The Package Engineering Manager oversees the package engineering team, driving the development of high-quality technology capabilities, ensuring the ongoing engineering support for the team, and implementing improvements in yield, cost, and cycle time.

Client Details

My client is a global leader in semiconductor manufacturing and distribution, offering an extensive range of active and end-of-life semiconductors. They provide comprehensive services, including design, wafer processing, assembly, and testing, delivering tailored solutions to accelerate time-to-market.

Description

Responsibilities:

• Oversee staff performance, address team member requests, manage timekeeping, and resolve personnel matters through guidance, coaching, and enforcement of systems, policies, and procedures.
• Handle the recruitment, selection, onboarding, training, and development of employees, focusing on both technical expertise and overall professional growth.
• Lead the implementation of packaging and assembly technology, ensuring adherence to company timelines while meeting cost and cycle time goals.
• Collaborate with cross-functional teams to enhance processes, methodologies, and systems impacting Rel operations.
• Manage workflow by developing production plans, assigning tasks, establishing performance goals, setting priorities, monitoring progress, adjusting schedules, resolving issues, and providing shift production summary reports.
• Ensure the ongoing implementation and maintenance of 6S practices and corporate standards.
• Evaluate processes for potential improvements in throughput and cost-efficiency, adjust processing variables, monitor key control points, develop reporting systems, and address any issues through corrective actions. This may involve coordination with vendors and suppliers.
• Promote a safe and clean work environment by educating staff on equipment use, process control points, and resource management, while ensuring compliance with company policies and procedures.

Profile

Ideal Candidate:

• A Bachelor's degree in engineering or equivalent technical experience in package engineering.
• At least 10 years of experience in assembly manufacturing, with a minimum of 5 years in a leadership role demonstrating strong leadership abilities, or a comparable combination of education and experience.
• Key Skills:
• Expertise in semiconductor package engineering methods and tools
• Proficiency in engineering and statistical techniques
• Experience in mentoring engineers
• Ability to assess equipment, materials, and techniques
• Commitment to high-quality standards and continuous improvement
• Represent, support, and encourage the organizational culture, ensuring the team follows established work practices, specifications, and policies.

Job Offer

What's To Offer:

• 401(k)
• Dental insurance
• Health insurance
• Life insurance
• Paid time off
• Vision insurance

MPI does not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity or expression, national origin, age, disability, veteran status, marital status, or based on an individual's status in any group or class protected by applicable federal, state or local law. MPI encourages applications from minorities, women, the disabled, protected veterans and all other qualified applicants.